Surface Mount Technology
At AWS Group we are proud of our extensive expertise in Surface Mount technologies. Our Investment in the latest equipment underlines our total commitment to the leading edge of electronics manufacturing.
- 8 fully automated SMT lines.
- SMT PCB assembly capabilities down to 01005 and fine pitch 10thou QFP’s, BGA and µBGA.
- Automatic Optical Inspection (AOI) x 8
- The ability to handle large PCBs up to 760x460mm (29x18inches)
- X-Tek iXS-3 X-Ray chamber with image capture and data logging x 2
- ERSASCOPE inspection systems with variable magnification and image capture
- ERSA 650A rework station with laser alignment, closed loop control
AWS has all the facilities necessary for the placement of BGA's including X-Ray and Ersascope equipment to validate the process. The Ersa rework station allows us to remove and replace faulty individual components without causing damage to other components on the board.
Compared with other fine pitch surface mount components having gull wing leads, BGA's offer several distinct advantages including:
- High pin count capability, generally more than 200, but gull-wing leads limited to less than 300 I/O's
- Larger lead pitches, which significantly reduces the manufacturing complexities for high I/O parts
- Higher packaging densities are achievable since the lead envelope for the gull-wing leads is not applicable in the case of BGA's; hence it is possible to mount more packages per board, i.e. higher packaging density
- Faster circuitry speed than gull-wing surface mount components (SMC's) because the terminations are much shorter and therefore less inductive and resistive
- Better heat dissipation
- Conventional SMT production technologies such as stencil printing and component mounting can be employed